 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS PC8103T, PC8108T MIXER + OSCILLATOR IC FOR PAGER SYSTEM DESCRIPTION PC8103T and PC8108T are silicon monolithic integrated circuits designed as mixer-oscillator series for pager system. Due to 1 V supply voltage, these ICs are suitable for low voltage pager system. These ICs are packaged in 6 pin mini mold suitable for high-density surface mounting. These ICs are manufactured using NEC's 20 GHz fT NESATTM III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials contributes excellent DC, AC performance. Thus, these ICs are utilized as 1 V voltage ICs. FEATURES * 1 V supply voltage: VCC = 1.0 V to 2.0 V * Low current consumption * Wide band operation PC8103T: lCC = 1.0 mA PC8108T: lCC = 1.5 mA TYP. TYP. @ VCC = 1.0 V @ VCC = 1.0 V PC8103T: fRF = 150 MHz to 330 MHz PC8108T: fRF = 150 MHz to 930 MHz * High-density surface mounting: 6 pin mini mold ORDERING INFORMATION PART NUMBER PACKAGE 6pin mini mold SUPPLYING FORM Embossed tape 8 mm wide, Pin 1, 2, 3 face to perforation side of tape. QTY 3 kp/Reel PC8103T-E3 PC8108T-E3 Note To order evaluation samples, please contact your local NEC sales office. (Order number: PC8103T, PC8108T) PIN CONNECTION (Top View) (Bottom View) 4 5 6 4 5 6 3 2 1 1: 2: 3: 4: 5: 6: RF INPUT GND OSC EMITTER OSC BASE VCC IF OUTPUT 2 1 C2C Markings 3 PC8103T: C2C PC8108T: C2F Caution Electro-static sensitive devices Document No. IC-3450 (O.D. No. IC-8980) Date Published July 1995 P Printed in Japan (c) 1995 PC8103T, PC8108T INTERNAL BOLOCK DIAGRAM (IN COMMON) 3 4 2 BIAS 5 1 6 Note Resonator must be externally equipped with 3 and 4 pins. (Refer to pin explanations) SYSTEM APPLICATION EXAMPLE AS PAGER 150 MHz to 330 MHz PC8102T PC8103T BPF BPF IF 450 MHz to 930 MHz Low noise transistor PC8108T BPF BPF IF This system application example schematically presents the chip set product line-up only, and does not imply a detail application circuit (In the case of application circuit example for PC8103T and PC8108T, please refer to page 21). For details on the related devices, refer to the latest data sheet of each device. 2 PC8103T, PC8108T PIN EXPLANATION (PC8103T, PC8108T IN COMMON) PIN NO. 1 PIN NAME RF input SUPPLY PIN VOLTAGE (V) VOLTAGE (V) -- 0.77 FUNCTION AND APPLICATION RF input for mixer. This port is low impedance. This ground pin must be connected to the system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. Track length should be kept as short as possible. Emitter, base pins of internal transistor for oscillator. These pins should be externally equipped with resonator circuit of X'tal or LC. Supply voltage pin. Connect bypass capacitor (eg 1 000 pF) to minimize ground impedance. IF output pin from mixer. This pin is designed as open collector and should be equipped with inductor (L) because of high impedance port. EQUIVALENT CIRCUIT 2 GND 0 -- 5 4 3 6 3 OSC Emitter -- 0.19 2 1 4 OSC Base -- 0.95 5 VCC 1.0 to 2.0 -- 6 IF Output Same bias as VCC through external inductor (L) -- Note Each PIN VOLTAGE is measured with VCC = 1.0 V. 3 PC8103T, PC8108T Unless otherwise specified, both product in common. ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage Power Dissipation SYMBOL VCC PD RATING 4.0 280 -40 to +85 -55 to +150 5 UNIT V mW C C V TA = +25 C CONDITIONS TA = +25 C, Pin 5 and 6 Mounted on 50 x 50 x 1.6 mm double copper clad epoxy glass PWB at TA = +85 C Operating Temperature Storage Temperature IF Output Voltage Peak Level TA Tstg VIFout MAX. RECOMMENDED OPERATING CONDITIONS PARAMETER Supply Voltage Operating Temperature RF Frequency RF Frequency SYMBOL VCC TA fRF fRF MIN. 1.0 -25 150 150 TYP. 1.05 +25 MAX. 2.0 +75 330 930 UNIT V C MHz MHz NOTE Pin 5 and 6 Possible to oscillate PD8103T PD8108T ELECTRICAL CHARACTERISTICS (TA = +25 C, VCC = 1.0 V, ZS = 50 , ZL = 2 k, fIF = 20 MHz, PLoin = -21 dBm externally, Upper local Note) PARAMETER Circuit Current Conversion Gain 1 SYMBOL MIN. ICC CG1 0.55 13 PC8103T TYP. 1 16 MAX. 1.4 19 MIN. 1.0 17.5 PC8108T TYP. 1.5 20.5 MAX. 2.1 23.5 UNIT mA dB CONDITIONS No input signals fRFin = 150 MHz, TEST CIRCUIT 1 fRFin = 280 MHz, TEST CIRCUIT 1 fRFin = 330 MHz, TEST CIRCUIT 1 fRFin = 450 MHz, TEST CIRCUIT 1 fRFin = 930 MHz, TEST CIRCUIT 1 Conversion Gain 2 CG2 12.5 15.5 18.5 17 20 23 dB Conversion Gain 3 CG3 12.5 15.5 18.5 17 20 23 dB Conversion Gain 4 CG4 - - - 16 19 22 dB Conversion Gain 5 CG5 - - - 12 15 18 dB Note Upper local means `fIF = fLoin - fRFin'. 4 PC8103T, PC8108T STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25 C, VCC = 1.0 V, ZS = ZL = 50 , fIF = 20 MHz, PLoin externally, Upper local) PC8103T PARAMETER SYMBOL PLoin = -21 dBm 13 PLoin = -10 dBm 9 PC8108T PLoin = -21 dBm 13 PLoin = -10 dBm 8.5 UNIT CONDITIONS Noise Figure 1 NF1 dB fRFin = 150 MHz, TEST CIRCUIT 2 fRFin = 280 MHz, TEST CIRCUIT 2 fRFin = 330 MHz, TEST CIRCUIT 2 fRFin = 450 MHz, TEST CIRCUIT 2 fRFin = 930 MHz, TEST CIRCUIT 2 Noise Figure 2 NF2 11.5 8 12 7 dB Noise Figure 3 NF3 12 9 13 8 dB Noise Figure 4 NF4 - - 13.5 8 dB Noise Figure 5 NF5 - - 18 11.5 dB Note Upper local means `fIF = fLoin - fRFin'. 5 PC8103T, PC8108T TEST CIRCUIT 1 RS = 50 , RL = 2 k (CG MEASUREMENT) Signal Generator (Lo) 50 1 000 pF C2 1 000 pF 3 300 pF 1 000 pF C3 C4 C5 VCC 2 C1 1 50 1 000 pF C2C NC 3 4 5 L 6 R C6 2 k* 1 000 pF 150 H 50 Signal Generator (RF) Supplement: (50 means impedance of measurement equipment) Spectrum Analyser * Note On 50 measurement, this high inpedance IFout needs the calculatiuon as follows CG (dB) = Measured value +20 log10 2 k 50 TEST CIRCUIT 2 RS = RL = 50 (NF MEASUREMENT) Signal Generator (Lo) 50 1 000 pF C2 1 000 pF 3 300 pF 1 000 pF C3 C4 C5 VCC 2 C1 1 1 000 pF 20 MHz C2C NC 3 4 5 L 6 150 H NOISE SOURCE NF meter C6 1 000 pF 50 50 6 PC8103T, PC8108T ILLUSTRATION OF TEST CIRCUITS ASSEMBLED ON EVALUATION BOARD SURFACE (IC mounted pattern) A C5 B B' Backside (Ground pattern) A' EX-LO C2 C3 C4 L RF IN IN C1 R C6 OUT IF OUT PC8103T 8108T C D D' C' Note (*1) 35 x 42 x 0.4 mm double sided copper clad polyimide board (*2) Solder plated pattern (*3) Surface vs. backside : A - A', B - B', C - C', D - D' (*4) (*6) should be removed. : Through holes (*5) In the care of NF measurement, remove R and short. 7 PC8103T, PC8108T CHARACTERISTIC CURVES (Unless otherwise specified with TEST CIRCUIT 1 or 2) -- PC8103T -- CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10 No signal 8 CIRCUIT CURRENT vs. OPERATING TEMPERATURE 8 No signal 7 6 5 VCC = 2.0 V 4 3 2 1 VCC = 0.9 V 0 0 1 2 3 4 0 -40 -20 0 20 40 60 80 100 VCC = 1.5 V VCC = 1.0 V Circuit Current ICC (mA) 6 4 2 Supply Voltage VCC (V) Circuit Current ICC (mA) Operating temperature TA (C) RF FREQUENCY vs. CONVERSION GAIN 35 VCC = 2.0 V 30 30 35 RF FREQUENCY vs. CONVERSION GAIN Conversion Gain CG (dB) 25 VCC = 1.5 V 20 15 10 5 PLoin = -10 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 0.5 1 VCC = 1.0 V VCC = 0.9 V Conversion Gain CG (dB) VCC = 2.0 V 25 20 VCC = 1.5 V 15 VCC = 1.0 V 10 5 PLoin = -21 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 VCC = 0.9 V 0 0.1 0 0.1 0.5 1 RF input frequency fRFin (GHz) RF input frequency fRFin (GHz) 8 PC8103T, PC8108T -- PC8103T -- RF FREQUENCY vs. CONVERSION GAIN 35 30 35 30 RF FREQUENCY vs. CONVERSION GAIN Conversion Gain CG (dB) 25 20 15 10 5 Conversion Gain CG (dB) TA =+85 C 25 20 15 TA = -20 C 10 5 VCC = 1.0 V PLoin = -21 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 TA = +85 C TA = -20 C TA = +25 C TA = +25 C 0 0.1 VCC = 1.0 V PLoin = -10 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 TA = -40 C TA = -40 C 0.5 1 0 0.1 0.5 1 RF input frequency fRFin (GHz) RF input frequency fRFin (GHz) RF FREQUENCY vs. CONVERSION GAIN 35 30 VCC = 0.9 V PLoin = -10 dBm PRFin = -35 dBm fIF = 20 MHz Upper local TA = +85 C 20 15 10 5 TA = -40 C 0 0.1 0.3 0.5 1 0 0.1 TA = +25 C 35 30 RF FREQUENCY vs. CONVERSION GAIN VCC = 0.9 V PLoin = -21 dBm PRFin = -35 dBm fIF = 20 MHz Upper local Conversion Gain CG (dB) Conversion Gain CG (dB) 25 25 20 TA = +85 C 15 TA = +25 C 10 TA = -20 C 5 TA = -40 C 0.3 0.5 1 TA = -20 C RF input frequency fRFin (GHz) RF input frequency fRFin (GHz) 9 PC8103T, PC8108T -- PC8103T -- RF FREQUENCY vs. CONVERSION GAIN 35 30 35 TA = +85 C TA = +25 C 30 TA = +25 C TA = +85 C RF FREQUENCY vs. CONVERSION GAIN Conversion Gain CG (dB) Conversion Gain CG (dB) 25 20 15 10 5 TA = -20 C TA = -40 C 25 20 15 10 5 TA = -40 C TA = -20 C 0 0.1 VCC = 2.0 V PLoin = -10 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 0.5 1 RF input frequency fRFin (GHz) 0 0.1 VCC = 2.0 V PLoin = -21 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 0.5 1 RF input frequency fRFin (GHz) RF FREQUENCY vs. CONVERSION GAIN 35 30 TA = +85 C TA = +25 C 35 30 RF FREQUENCY vs. CONVERSION GAIN Conversion Gain CG (dB) Conversion Gain CG (dB) 25 20 15 10 5 TA = -20 C TA = -40 C 25 20 TA = +85 C TA = +25 C TA = -20 C 15 10 5 TA = -40 C 0 0.1 VCC = 1.5 V PLoin = -10 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 0.5 1 RF input frequency fRFin (GHz) 0 0.1 VCC = 1.5 V PLoin = -21 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 0.5 1 RF input frequency fRFin (GHz) 10 PC8103T, PC8108T -- PC8103T -- Local input level vs. CONVERSION GAIN 35 30 VCC = 0.9 V PRFin = -35 dBm fIF = 20 MHz 30 Upper local 25 20 fRFin = 150 MHz 15 10 5 0 -30 fRFin = 900 MHz fRFin = 450 MHz -25 -20 -15 -10 0 -30 -25 -20 -15 -10 35 Local input level vs. CONVERSION GAIN VCC = 1.0 V PRFin = -35 dBm fIF = 20 MHz Upper local 25 20 15 fRFin = 900 MHz 10 fRFin = 450 MHz 5 fRFin = 280 MHz fRFin = 150 MHz Conversion Gain CG (dB) fRFin = 280 MHz Local input level PLoin (dBm) Conversion Gain CG (dB) Local input level PLoin (dBm) Local input level vs. CONVERSION GAIN 35 30 35 30 Local input level vs. CONVERSION GAIN fRFin = 150 MHz fRFin = 150 MHz Conversion Gain CG (dB) Conversion Gain CG (dB) 25 fRFin = 280 MHz 20 15 10 5 0 -30 fRFin = 450 MHz fRFin = 900 MHz 25 20 15 10 5 0 -30 fRFin = 280 MHz fRFin = 450 MHz fRFin = 900 MHz VCC = 1.5 V PRFin = -35 dBm fIF = 20 MHz Upper local -25 -20 -15 -10 VCC = 2.0 V PRFin = -35 dBm fIF = 20 MHz Upper local -25 -20 -15 -10 Local input level PLoin (dBm) Local input level PLoin (dBm) 11 PC8103T, PC8108T -- PC8103T -- Local input level vs. CONVERSION GAIN 25 TA = +85 C 20 20 25 TA = +85 C Local input level vs. CONVERSION GAIN Conversion Gain CG (dB) 15 TA = -40 C TA = -20 C Conversion Gain CG (dB) TA = +25 C TA = +25 C 15 10 10 TA = -20 C 5 TA = -40 C 5 VCC = 1.0 V 0 PRFin = -35 dBm fRFin = 150 MHz fLoin = 170 MHz -5 -30 -25 -20 -15 -10 VCC = 1.0 V 0 PRFin = -35 dBm fRFin = 280 MHz fLoin = 300 MHz -5 -30 -25 -20 -15 -10 Local input level PLoin (dBm) Local input level PLoin (dBm) RF FREQUENCY vs. NOISE FIGURE 20 PLoin = -21 dBm fIF = 20 MHz Upper local VCC = 1.0 V 15 15 20 RF FREQUENCY vs. NOISE FIGURE PLoin = -10 dBm fIF = 20 MHz Upper local Noise Figure NF (dB) Noise Figure NF (dB) VCC = 1.0 V 10 10 VCC = 1.5 V VCC = 1.5 V 5 5 0 0.1 0.3 0.5 1 0 0.1 0.3 0.5 1 RF input frequency fRFin (GHz) RF input frequency fRFin (GHz) 12 PC8103T, PC8108T -- PC8103T -- RF input level vs. IF output level and IM3 +10 VCC = 1.0 V fLoin = 170 MHz PLoin = -21 dBm 0 fRFin (des) = 150.0 MHz fRFin (undes) = 150.5 MHz TEST CIRCUIT 1 -10 IFout 0 +10 VCC = 1.0 V fLoin = 300 MHz PLoin = -21 dBm fRFin (des) = 280.0 MHz fRFin (undes) = 280.5 MHz TEST CIRCUIT 1 -10 IFout RF input level vs. IF output level and IM3 IF output level of each tone PIF (dBm) 3rd order intermodelation distortion level IM3 (dBm) -20 IF output level of each tone PIF (dBm) 3rd order intermodelation distortion level IM3 (dBm) -20 -30 -30 -40 IM3 -40 IM3 -50 -50 -60 -50 -40 -30 -20 -10 -60 -50 -40 -30 -20 -10 RF input level PRFin (dBm) RF input level PRFin (dBm) 13 PC8103T, PC8108T -- PC8108T -- CIRCUIT CURRENT vs. SUPPLY VOLTAGE 14 12 8 No sigual CIRCUIT CURRENT vs. OPERATING TEMPERATURE 10 No sigual 9 VCC = 2.0 V 7 6 5 4 3 2 2 0 1 0 1 2 3 4 0 -40 -20 0 20 40 60 VCC = 0.9 V 80 100 VCC = 1.0 V VCC = 1.5 V Circuit Current ICC (mA) 10 8 6 4 Circuit Current ICC (mA) Supply Voltage VCC (V) Operating Temperature TA (C) RF FREQUENCY vs. CONVERSION GAIN 35 VCC = 2.0 V 30 30 35 RF FREQUENCY vs. CONVERSION GAIN Conversion Gain CG (dB) 25 20 15 10 5 PLoin = -10 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 0.5 1 VCC = 1.0 V VCC = 0.9 V Conversion Gain CG (dB) VCC = 1.5 V VCC = 2.0 V 25 20 15 10 5 PLoin = -21 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 0.5 1 VCC = 1.5 V VCC = 1.0 V VCC = 0.9 V 0 0.1 0 0.1 RF input frequency fRFin (GHz) RF input frequency fRFin (GHz) 14 PC8103T, PC8108T -- PC8108T -- RF FREQUENCY vs. CONVERSION GAIN 35 TA = +85 C 30 TA = +25 C 30 35 RF FREQUENCY vs. CONVERSION GAIN Conversion Gain CG (dB) Conversion Gain CG (dB) 25 20 15 10 5 TA = -20 C 25 20 15 10 5 TA = +85 C TA = +25 C TA = -40 C TA = -20 C VCC = 1.0 V PLoin = -21 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 TA = -40 C 0 0.1 VCC = 1.0 V PLoin = -10 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 0.5 1 RF input frequency fRFin (GHz) 0 0.1 0.5 1 RF input frequency fRFin (GHz) RF FREQUENCY vs. CONVERSION GAIN 35 30 TA = +85 C 35 30 RF FREQUENCY vs. CONVERSION GAIN VCC = 0.9 V PLoin = -21 dBm PRFin = -35 dBm fIF = 20 MHz Upper local TA = +85 C TA = +25 C 15 TA = -20 C 10 5 TA = -40 C 0 0.1 Conversion Gain CG (dB) Conversion Gain CG (dB) 25 TA = +25 C 20 TA = -20 C 15 10 5 25 20 0 0.1 VCC = 0.9 V PLoin = -10 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 TA = -40 C 0.5 1 0.3 0.5 1 RF input frequency fRFin (GHz) RF input frequency fRFin (GHz) 15 PC8103T, PC8108T -- PC8108T -- RF FREQUENCY vs. CONVERSION GAIN 35 30 TA = +85 C TA = +25 C 35 30 RF FREQUENCY vs. CONVERSION GAIN Conversion Gain CG (dB) 25 20 15 10 5 TA = -20 C TA = -40 C Conversion Gain CG (dB) TA = +85 C 25 20 15 10 5 TA = +25 C TA = -20 C TA = -40 C 0 0.1 VCC = 1.5 V PLoin = -10 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 0.5 1 RF input frequency fRFin (GHz) 0 0.1 VCC = 1.5 V PLoin = -21 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 0.5 1 RF input frequency fRFin (GHz) RF FREQUENCY vs. CONVERSION GAIN 35 TA = +85 C 30 TA = +25 C 30 35 RF FREQUENCY vs. CONVERSION GAIN TA = +85 C Conversion Gain CG (dB) Conversion Gain CG (dB) TA = -20 C 25 20 15 10 5 TA = -40 C 25 20 TA = -20 C 15 10 5 TA = +25 C TA = -40 C 0 0.1 VCC = 2.0 V PLoin = -10 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 0.5 1 RF input frequency fRFin (GHz) 0 0.1 VCC = 2.0 V PLoin = -21 dBm PRFin = -35 dBm fIF = 20 MHz Upper local 0.3 0.5 1 RF input frequency fRFin (GHz) 16 PC8103T, PC8108T -- PC8108T -- Local input level vs. CONVERSION GAIN 35 30 35 30 Local input level vs. CONVERSION GAIN Conversion Gain CG (dB) fRFin = 150 MHz fRFin = 280 MHz 25 fRFin = 150 MHz 20 15 10 5 0 -30 Conversion Gain CG (dB) fRFin = 280 MHz 25 20 fRFin = 900 MHz 15 fRFin = 450 MHz 10 5 0 -30 VCC = 1.0 V PRFin = -35 dBm fIF = 20 MHz Upper local -25 -20 -15 -10 fRFin = 900 MHz VCC = 0.9 V fRFin = 450 MHz PRFin = -35 dBm fIF = 20 MHz Upper local -25 -20 -15 -10 Local input level PLoin (dBm) Local input level PLoin (dBm) Local input level vs. CONVERSION GAIN 35 30 fRFin = 280 MHz 35 Local input level vs. CONVERSION GAIN fRFin = 280 MHz 30 Conversion Gain CG (dB) Conversion Gain CG (dB) 25 20 15 10 5 0 -30 fRFin = 150 MHz fRFin = 900 MHz 25 20 15 10 5 0 -30 fRFin = 150 MHz fRFin = 900 MHz fRFin = 450 MHz fRFin = 450 MHz VCC = 1.5 V PRFin = -35 dBm fIF = 20 MHz Upper local -25 -20 -15 -10 VCC = 2.0 V PRFin = -35 dBm fIF = 20 MHz Upper local -25 -20 -15 -10 Local input level PLoin (dBm) Local input level PLoin (dBm) 17 PC8103T, PC8108T -- PC8108T -- Local input level vs. CONVERSION GAIN 30 TA = +85 C 25 TA = +25 C 25 TA = +25 C 30 TA = +85 C Local input level vs. CONVERSION GAIN Conversion Gain CG (dB) 20 TA = -40 C 15 TA = -20 C 10 VCC = 1.0 V 5 fRFin = 280 MHz PRFin = -35 dBm fLoin = 170 MHz 0 -30 -25 -20 -15 -10 Conversion Gain CG (dB) 20 TA = -40 C 15 TA = -20 C 10 VCC = 1.0 V 5 fRFin = 150 MHz PRFin = -35 dBm fLoin = 170 MHz 0 -30 -25 -20 -15 -10 Local input level PLoin (dBm) Local input level PLoin (dBm) Local input level vs. CONVERSION GAIN 30 TA = +85 C 25 25 30 Local input level vs. CONVERSION GAIN TA = +85 C Conversion Gain CG (dB) 20 Conversion Gain CG (dB) TA = +25 C 20 TA = +25 C 15 TA = -20 C 10 TA = -40 C 15 TA = -40 C 10 TA = -20 C 5 VCC = 1.0 V fRFin = 900 MHz PRFin = -35 dBm fLoin = 920 MHz 0 -30 VCC = 1.0 V 5 fRFin = 450 MHz PRFin = -35 dBm fLoin = 470 MHz 0 -30 -25 -20 -15 -10 -25 -20 -15 -10 Local input level PLoin (dBm) Local input level PLoin (dBm) 18 PC8103T, PC8108T -- PC8108T -- RF FREQUENCY vs. NOISE FIGURE 20 VCC = 1.5 V 15 Noise Figure NF (dB) RF FREQUENCY vs. NOISE FIGURE 20 15 VCC = 1.0 V Noise Figure NF (dB) VCC = 1.5 V 10 VCC = 1.0 V 10 VCC = 1.0 V 5 PLoin = -10 dBm fIF = 20 MHz Upper local VCC = 1.5 V 5 PLoin = -21 dBm fIF = 20 MHz Upper local 0 0.1 0.3 0.5 1 0 0.1 0.3 0.5 1 RF input frequency fRFin (GHz) RF input frequency fRFin (GHz) RF input level vs. IF output level and IM3 +10 VCC = 1.0 V fLoin = 170 MHz PLoin = -21 dBm 0 fRFin (des) = 150.000 MHz fRFin (undes) = 150.025 MHz IF output level of each tone PIF (dBm) 3rd order intermodulation distortion IM3 (dBm) IF output level of each tone PIF (dBm) 3rd order intermodulation distortion IM3 (dBm) RF input level vs. IF output level and IM3 +10 VCC = 1.0 V fLoin = 300 MHz PLoin = -21 dBm 0 fRFin (des) = 280.000 MHz fRFin (undes) = 280.025 MHz TEST CIRCUIT 1 -10 IFout TEST CIRCUIT 1 -10 IFout -20 -20 -30 -30 -40 IM3 -40 IM3 -50 -50 -60 -50 -40 -30 -20 -10 -60 -50 -40 -30 -20 -10 RF input level PRFin (dBm) RF input level PRFin (dBm) 19 PC8103T, PC8108T -- PC8108T -- RF input level vs. IF output level and IM3 +10 VCC = 1.0 V fLoin = 470 MHz PLoin = -21 dBm 0 fRFin (des) = 450.000 MHz fRFin (undes) = 450.025 MHz TEST CIRCUIT 1 -10 IFout 0 +10 VCC = 1.0 V fLoin = 950 MHz PLoin = -21 dBm fRFin (des) = 930.000 MHz fRFin (undes) = 930.025 MHz TEST CIRCUIT 1 -10 IFout RF input level vs. IF output level and IM3 IF output level of each tone PIF (dBm) 3rd order intermodulation distortion IM3 (dBm) -20 IF output level of each tone PIF (dBm) 3rd order intermodulation distortion IM3 (dBm) -20 -30 -30 -40 IM3 -40 IM3 -50 -50 -60 -50 -40 -30 -20 -10 -60 -50 -40 -30 -20 -10 RF input level PRFin (dBm) RF input level PRFin (dBm) 20 PC8103T, PC8108T Application circuit example (In the case of PC8103T) 8 pF C4 150 nH (68+82 nH) L2+L3 152.2400 MHz (Overtone Xtal) C5 3 4 R2 4.3 k VCC (1.05 V) L4 6 1 000 pF 150 H C7 X'tal BPF C6 1 000 pF High impedance IF OUT 21.7 MHz (KSS 21.7-7A) C1 1 000 pF 16 pF C2C C2 R1 4.3 k L1 56 nH 2 22 pF 5 11 pF C3 1 Low impedance RF IN (173.94 MHz, -40 dBm) ILLUSTRATION OF APPLICATION CIRCUIT ASSEMBLED ON EVALUATION BOARD A SURFACE B B' BACKSIDE A' R2 L1 C3 R1 C2 (EX-LO) C4 L2 L3 C6 L4 C5 X'tal BPF RF IN IN C1 C7 OUT IF OUT PC8103T 8108T C D D' C' Note (*1) 35 x 42 x 0.4 mm double copper clad polyimide board (*2) Solder plated pattern (*3) Surface vs. Backside : A - A', B - B', C - C', D - D' (*4) : Through holes The application circuits and their parameters are for references only and are not intended for use in actual design-in's. 21 PC8103T, PC8108T -- With application circuit (PC8103T) -- RF input level vs. IF output level Spectrum of Overtone Oscillation (without RF signal) REF 0.0 dBm 10 dB/ ATTEN 10 dB MKR 152.0 MHz -32.30 dBm 0 -10 IF Output level PIF (dBm) MARKER 152.0 MHz -32.30 dBm -20 -30 -40 -50 -40 -30 -20 -10 0 RF input level PRFin (dBm) This measurement needs the calculation as same as TEST CIRCUIT 1. CENTER 100 MHz RES BW 1 MHz ref. VBW 1 kHz SPAN 200 MHz SWP 1.00 sec 2 x ref. (desired OSC freq.) 5 1 000 pF 4 Spectrum Analyzer (@ No RF signal) 22 PC8103T, PC8108T 6 PIN MINI MOLD PACKAGE DIMENSIONS (Unit : mm) 0.3 +0.1 -0.05 0.130.1 1 2.8 +0.2 -0.3 1.5 +0.2 -0.1 2 3 0 to 0.1 6 5 0.95 1.9 2.90.2 4 0.95 0.8 1.1 +0.2 -0.1 23 PC8103T, PC8108T NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to maintain the minimum ground impedance (to prevent undesired oscillation). (3) Keep the wiring length of the ground pins as short as possible. (4) Connect a bypass capacitor (eg 1 000 pF) to the Vcc pin. (5) Insert the inductor (eg L = 150 H) between 5 and 6 pins. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. PC8103T, PC8108T Soldering process Infrared ray reflow Soldering conditions Package peak temperature: 235 C, Hour: within 30 s. (more than 210 C), Time: 2 time, Limited days: no.Note Package peak temperature: 215 C, Hour: within 40 s. (more than 200 C), Time: 2 time, Limited days: no.Note Soldering tub temperature: less than 260 C, Hour: within 10 s. Time: 1 time, Limited days: no.Note Pin area temperature: less than 300 C, Hour: within 10 s. Limited days: no.Note Recommended condition symbol IR35-00-2 VPS VP15-00-2 Wave soldering WS60-00-1 Pin part heating Note It is the storage days after opening a dry pack, the storage conditions are 25 C, less than 65 % RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (IEI-1207) 24 PC8103T, PC8108T [MEMO] 25 PC8103T, PC8108T [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11 NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. 16 |
Price & Availability of UPC8103T-E3
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |